FA introduction
Analysis of non -destructive failure analysis
Visual inspection
Visual inspection
X-Ray
SAT
SEM EDS
Curve tracer(IV)
Destructive failure analysis
Cross section
Decapsulation
Crater test
IMC
RA介绍
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Packaging related reliability verification: It is used for verification of the failure mechanism related to the material or packaging process. The test items mainly include environmental stress test and other tests
一.Environmental stress test：1. MSL /Preconditioning
2. High Temperature Storage(HTS)
3. Temperature Humidity bias(THB) 4. Highly Accelerated Temperature and Humidity Stress(HAST)
5. Temperature Cycling(TC)
6. Unbiased Temperature/Humidity (Unbiased HAST)-uHAST
7. Unbiased Temperature/Humidity (Autoclave)-PCT
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二.Other tests1. Solderability
2. One -arm drop test
3. Double Rolling Tube Falling Test
4. Vibration test
5. Solder Ball Shear
6. Wire Pull Strength
7. Bond ball shear
